March 5, 2024

In-Mold Electronics Market is Estimated to Reach USD 2,443.10 Million by 2030

The in-mold electronics market was estimated at US$ 170.5 million last year and is projected to hit around US$ 2,443.10 million by 2030, registering a CAGR of 34.4% between 2021 and 2030. The report contains 180+ pages with detailed analysis.

In-Mold Electronics Market Size 2022-2030

The in-mold electronics market is growing rapidly owing to the rising adoption of in-mold electronics across various industries such as automotive, consumer electronics, aerospace and numerous others. The in-mold electronics helps the manufacturers of different products to add desired design, reduce cost, reduce weight, and increase time-efficiency in the product manufacturing process.

The increased demand for the various electronic products such as smartphones, tablets, and laptops has significant contributions towards the development of the global in-mold electronics market. The flexibility and durability of the in-mold electronics is boosting its adoption across the globe. Moreover, rapidly growing healthcare, automotive, and aerospace industry is expected to exponentially fuel the growth of the global in-mold electronics market during the forecast period. The rising investments in the research and development of the various digital products are boosting the adoption of the in-mold electronics as most of the digital products use capacitive touch sensors.

Download a Free Sample Pages (Including TOC, List of Tables & Figures, and Chart) @ https://www.precedenceresearch.com/sample/1431

Report Scope of the In-Mold Electronics Market
Report Coverage Details
Market Size in 2020 USD 127.5 Million
Growth Rate From 2021 to 2030 CAGR of 34.4%
Largest Market North America
Fastest Growing Market Asia Pacific
Base Year 2021
Forecast Period 2021 to 2030
Segments Covered Ink Type, Application, Region
Market Dynamics

Driver: Advancements in the touch sensors

The increased investments in the development of advanced gadgets resulted in the adoption of the in-mold electronics which offers capacitive touch sensors. The capacitive touch sensors are used in the smartphones, automotive consoles, dryers, washing machines, laptops, and wider variety of products. Moreover, the various benefits such as cost efficiency and time savings offered by the in-mold electronics is expected to drive the market during the forecast period.

Restraints: Increased complications in the design

With the technological advancements, the demand for the miniature or the compact devices is witnessing rapid upsurge across the globe. With the development of the compact devices, the complications in the circuitry is rising that may further lead to further problems in the production.

Read Also: Automotive Aftermarket to Garner US$ 950.09 Billion by 2027

Opportunities: The rising number of strategies by the market players

The market is fragmented with presence of several players in the market and various developmental strategies such as product launches, acquisitions, agreement, and partnerships highly influences the market growth. For instance, in 2020, Mino Group and GenesInk entered into a partnership. This partnership aimed at expanding the business of the GenesInk in Asia Pacific region.

Trends: Rising penetration of in-mold electronics in multiple industries

The globe is witnessing the growing importance of various digital technologies. Almost all the industries in the globe are affected by the use of the digital technologies. The rising importance of digital technologies had resulted in the adoption of various devices and equipment in almost all the industries of the globe. Hence, the rising penetration of digital hardware devices in different industries is expected to drive the market growth in future.

The key players profiled in the global in-mold electronics market are
  • Butler Technologies
  • GenesInk
  • DuPont de Numours
  • InMold Solutions
  • YOMURA
  • Golden Valley Products
  • DuraTech Industries
  • Eastprint Incorporated
  • Nissha Co. Ltd.
  • TactoTek Oy

Market Segmentation

By Ink Type

  • Silver Conductive
  • Carbon Conductive
  • Others

By Application

  • Building Automation
  • Automotive
  • Healthcare
  • Consumer Products
  • Others

Regional Segmentation

  • North America (U.S. and Canada)
  • Europe (Germany, France, U.K., Italy, Spain, Rest of Europe)
  • Asia-Pacific (China, Japan, India, Southeast Asia and Rest of APAC)
  • Latin America (Brazil and Rest of Latin America)
  • Middle East and Africa (GCC, North Africa, South Africa, Rest of MEA)

TABLE OF CONTENT

Chapter 1. Introduction

1.1. Research Objective

1.2. Scope of the Study

1.3. Definition

Chapter 2. Research Methodology

2.1. Research Approach

2.2. Data Sources

2.3. Assumptions & Limitations

Chapter 3. Executive Summary

3.1. Market Snapshot

Chapter 4. Market Variables and Scope 

4.1. Introduction

4.2. Market Classification and Scope

4.3. Industry Value Chain Analysis

4.3.1. Raw Material Procurement Analysis

4.3.2. Sales and Distribution Channel Analysis

4.3.3. Downstream Buyer Analysis

Chapter 5. COVID 19 Impact on In-Mold Electronics Market 

5.1. COVID-19 Landscape: In-Mold Electronics Industry Impact

5.2. COVID 19 – Impact Assessment for the Industry

5.3. COVID 19 Impact: Global Major Government Policy

5.4. Market Trends and Opportunities in the COVID-19 Landscape

Chapter 6. Market Dynamics Analysis and Trends

6.1. Market Dynamics

6.1.1. Market Drivers

6.1.2. Market Restraints

6.1.3. Market Opportunities

6.2. Porter’s Five Forces Analysis

6.2.1. Bargaining power of suppliers

6.2.2. Bargaining power of buyers

6.2.3. Threat of substitute

6.2.4. Threat of new entrants

6.2.5. Degree of competition

Chapter 7. Competitive Landscape

7.1.1. Company Market Share/Positioning Analysis

7.1.2. Key Strategies Adopted by Players

7.1.3. Vendor Landscape

7.1.3.1. List of Suppliers

7.1.3.2. List of Buyers

Chapter 8. Global In-Mold Electronics Market, By Ink

8.1. In-Mold Electronics Market, by Ink Type, 2021-2030

8.1.1. Silver Conductive

8.1.1.1. Market Revenue and Forecast (2019-2030)

8.1.2. Carbon Conductive

8.1.2.1. Market Revenue and Forecast (2019-2030)

8.1.3. Others

8.1.3.1. Market Revenue and Forecast (2019-2030)

Chapter 9. Global In-Mold Electronics Market, By Application

9.1. In-Mold Electronics Market, by Application, 2021-2030

9.1.1. Building Automation

9.1.1.1. Market Revenue and Forecast (2019-2030)

9.1.2. Automotive

9.1.2.1. Market Revenue and Forecast (2019-2030)

9.1.3. Healthcare

9.1.3.1. Market Revenue and Forecast (2019-2030)

9.1.4. Consumer Products

9.1.4.1. Market Revenue and Forecast (2019-2030)

9.1.5. Others

9.1.5.1. Market Revenue and Forecast (2019-2030)

Chapter 10. Global In-Mold Electronics Market, Regional Estimates and Trend Forecast

10.1. North America

10.1.1. Market Revenue and Forecast, by Ink (2019-2030)

10.1.2. Market Revenue and Forecast, by Application (2019-2030)

10.1.3. U.S.

10.1.3.1. Market Revenue and Forecast, by Ink (2019-2030)

10.1.3.2. Market Revenue and Forecast, by Application (2019-2030)

10.1.4. Rest of North America

10.1.4.1. Market Revenue and Forecast, by Ink (2019-2030)

10.1.4.2. Market Revenue and Forecast, by Application (2019-2030)

10.2. Europe

10.2.1. Market Revenue and Forecast, by Ink (2019-2030)

10.2.2. Market Revenue and Forecast, by Application (2019-2030)

10.2.3. UK

10.2.3.1. Market Revenue and Forecast, by Ink (2019-2030)

10.2.3.2. Market Revenue and Forecast, by Application (2019-2030)

10.2.4. Germany

10.2.4.1. Market Revenue and Forecast, by Ink (2019-2030)

10.2.4.2. Market Revenue and Forecast, by Application (2019-2030)

10.2.5. France

10.2.5.1. Market Revenue and Forecast, by Ink (2019-2030)

10.2.5.2. Market Revenue and Forecast, by Application (2019-2030)

10.2.6. Rest of Europe

10.2.6.1. Market Revenue and Forecast, by Ink (2019-2030)

10.2.6.2. Market Revenue and Forecast, by Application (2019-2030)

10.3. APAC

10.3.1. Market Revenue and Forecast, by Ink (2019-2030)

10.3.2. Market Revenue and Forecast, by Application (2019-2030)

10.3.3. India

10.3.3.1. Market Revenue and Forecast, by Ink (2019-2030)

10.3.3.2. Market Revenue and Forecast, by Application (2019-2030)

10.3.4. China

10.3.4.1. Market Revenue and Forecast, by Ink (2019-2030)

10.3.4.2. Market Revenue and Forecast, by Application (2019-2030)

10.3.5. Japan

10.3.5.1. Market Revenue and Forecast, by Ink (2019-2030)

10.3.5.2. Market Revenue and Forecast, by Application (2019-2030)

10.3.6. Rest of APAC

10.3.6.1. Market Revenue and Forecast, by Ink (2019-2030)

10.3.6.2. Market Revenue and Forecast, by Application (2019-2030)

10.4. MEA

10.4.1. Market Revenue and Forecast, by Ink (2019-2030)

10.4.2. Market Revenue and Forecast, by Application (2019-2030)

10.4.3. GCC

10.4.3.1. Market Revenue and Forecast, by Ink (2019-2030)

10.4.3.2. Market Revenue and Forecast, by Application (2019-2030)

10.4.4. North Africa

10.4.4.1. Market Revenue and Forecast, by Ink (2019-2030)

10.4.4.2. Market Revenue and Forecast, by Application (2019-2030)

10.4.5. South Africa

10.4.5.1. Market Revenue and Forecast, by Ink (2019-2030)

10.4.5.2. Market Revenue and Forecast, by Application (2019-2030)

10.4.6. Rest of MEA

10.4.6.1. Market Revenue and Forecast, by Ink (2019-2030)

10.4.6.2. Market Revenue and Forecast, by Application (2019-2030)

10.5. Latin America

10.5.1. Market Revenue and Forecast, by Ink (2019-2030)

10.5.2. Market Revenue and Forecast, by Application (2019-2030)

10.5.3. Brazil

10.5.3.1. Market Revenue and Forecast, by Ink (2019-2030)

10.5.3.2. Market Revenue and Forecast, by Application (2019-2030)

10.5.4. Rest of LATAM

10.5.4.1. Market Revenue and Forecast, by Ink (2019-2030)

10.5.4.2. Market Revenue and Forecast, by Application (2019-2030)

Chapter 11. Company Profiles

11.1. Butler Technologies

11.1.1. Company Overview

11.1.2. Product Offerings

11.1.3. Financial Performance

11.1.4. Recent Initiatives

11.2. GenesInk

11.2.1. Company Overview

11.2.2. Product Offerings

11.2.3. Financial Performance

11.2.4. Recent Initiatives

11.3. DuPont de Numours

11.3.1. Company Overview

11.3.2. Product Offerings

11.3.3. Financial Performance

11.3.4. Recent Initiatives

11.4. InMold Solutions

11.4.1. Company Overview

11.4.2. Product Offerings

11.4.3. Financial Performance

11.4.4. Recent Initiatives

11.5. YOMURA

11.5.1. Company Overview

11.5.2. Product Offerings

11.5.3. Financial Performance

11.5.4. Recent Initiatives

11.6. Golden Valley Products

11.6.1. Company Overview

11.6.2. Product Offerings

11.6.3. Financial Performance

11.6.4. Recent Initiatives

11.7. DuraTech Industries

11.7.1. Company Overview

11.7.2. Product Offerings

11.7.3. Financial Performance

11.7.4. Recent Initiatives

11.8. Eastprint Incorporated

11.8.1. Company Overview

11.8.2. Product Offerings

11.8.3. Financial Performance

11.8.4. Recent Initiatives

11.9. Nissha Co. Ltd.

11.9.1. Company Overview

11.9.2. Product Offerings

11.9.3. Financial Performance

11.9.4. Recent Initiatives

11.10. TactoTek Oy

11.10.1. Company Overview

11.10.2. Product Offerings

11.10.3. Financial Performance

11.10.4. Recent Initiatives

Chapter 12. Research Methodology

12.1. Primary Research

12.2. Secondary Research

12.3. Assumptions

Chapter 13. Appendix

13.1. About Us

13.2. Glossary of Terms

Thanks for reading you can also get individual chapter-wise sections or region-wise report versions such as North America, Europe, or the Asia Pacific.

Source@ https://www.globenewswire.com/en/news-release/2022/01/04/2360927/0/en/In-Mold-Electronics-Market-Size-to-Worth-Around-US-2-44-Bn-by-2030.html

Daily Tech Daily Tech

Daily Tech Bulletin is one of the leading newswire distribution networks, specializing in the delivery of corporate press releases, financial announcements, and multimedia content to media, investors, and consumers worldwide. US Web Wire covers all significant healthcare news, technology, and automotive news. We also publish a wide range of market research articles, press releases, white papers, and case studies.

View all posts by Daily Tech Daily Tech →

Leave a Reply

Your email address will not be published. Required fields are marked *